Ag　nanopaste　is　one　of　the　most　promising　die-attach　materials　in　power　devices.　In　this　work,　robust　sintered　SiC　devices　are　achieved　by　using　graphene　reinforced　Ag　nanopaste　to　improve　the　heat　dissipation　and　shear　strength.　Microstructure,　mechanical,　and　electrical　properties　of　the　sintered　joints　are　investigated.　The　addition　graphene　can　bring　exciting　performance　improvements,　and　graphene　(＜0.25　wt%)　is　found　to　be　enough　to　bridge　voids　among　Ag　particles.　The　decomposition　temperature　of　nanopaste　exhibits　an　increasing　trend　with　the　increase　of　graphene　content.　The　sintered　layer　forms　metallurgical　interfaces　between　chip　and　substrate,　while　excellent　metallurgical　combination　ensures　the　mechanical,　electrical,　and　thermal　properties　of　die　attachments.　The　joint　strength　is　significantly　improved　after　adding　graphene　compared　with　pristine　Ag　nanopaste,　especially　when　sintered　at　a　lower　temperature　of　230　degrees　C,　the　joint　strength　is　increased　by　3　similar　to　4　times.　Good　interconnection　can　be　achieved　at　a　sintering　temperature　of　190　degrees　C.　Low　temperature　interconnection,　fast　sintering　(sintering　time:　＞=　1　min),　and　lower　thermal　resistance　and　junction　temperature　will　provide　an　effective　way　to　enhance　the　quality　of　the　sintered　Ag　joints,　which　is　promising　for　the　attachment　of　power　devices　in　new　energy　vehicles.