Conventional　packaging　materials　are　difficult　to　support　long-lasting　service　in　high-temperature　environments.　In　this　study,　the　novel　nano　Ag-Cu　foam　sheet　was　prepared　by　dealloying　etching,　and　achieved　joining　chips　and　substrates　by　sintering　at　low　temperature.　The　microstructure,　mechanical　properties　and　fracture　path　of　the　sintered　joint　were　analyzed.　The　grain　size　in　the　sintered　interface　showed　a　gradient　change,　which　brought　excellent　shear　strength.　The　sintered　joint　showed　that　the　oxidation　behavior　caused　during　the　hightemperature　aging　tests　would　reduce　the　shear　strength.　The　energy　absorption　effect　of　the　sintered　layer　could　alleviate　joint　fatigue　under　thermal　shock　conditions,　thus　ensuring　the　robust　lifetime　of　the　sintered　joint　for　high-temperature　application.