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Author:

Dai, Yanwei (Dai, Yanwei.) (Scholars:代岩伟) | Liu, Yinghua (Liu, Yinghua.) | Qin, Fei (Qin, Fei.) (Scholars:秦飞) | Chao, Yuh J. (Chao, Yuh J..) | Chen, Haofeng (Chen, Haofeng.)

Indexed by:

EI Scopus SCIE

Abstract:

Due to the potential influence of constraint effect on failure assessment, a link is needed to bridge the constraint effect characterized by higher order term asymptotic solution and time dependent failure assessment diagram (TDFAD). In this paper, a modification method for creep toughness incorporating C(t)-A(2)(t) theory is proposed based on Nikbin-Smith-Webster model. The relation between Q-term and A(2)(t)-term is also presented for creep crack. Results show that the creep toughness can be influenced by constraint parameter remarkably. A modified TDFAD is proposed based on C(t)-A(2)(t) solution. Based on the creep data of 316H stainless steel and various compact tension specimens, the modified TDFAD curves considering constraint effect characterized with A(2)(t)-term is presented and discussed, which indicates the important role of constraint effect on the assessment boundary of TDFAD. The research given in this paper can provide an alternative method in which the constraint effect can be included in TDFAD under high temperature.

Keyword:

Constraint effect A(2)*-parameter CT specimen Creep toughness TDFAD

Author Community:

  • [ 1 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Liu, Yinghua]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China
  • [ 4 ] [Chao, Yuh J.]Univ South Carolina, Dept Mech Engn, 300 S Main St, Columbia, SC 29208 USA
  • [ 5 ] [Chen, Haofeng]Univ Strathclyde, Dept Mech & Aerosp Engn, Glasgow G1 1XJ, Lanark, Scotland

Reprint Author's Address:

  • 代岩伟

    [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

ISSN: 0020-7403

Year: 2020

Volume: 165

7 . 3 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:115

Cited Count:

WoS CC Cited Count: 12

SCOPUS Cited Count: 12

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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