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Author:

Wang, Tongju (Wang, Tongju.) | Liu, Yahao (Liu, Yahao.) | Zhang, Wenqian (Zhang, Wenqian.) | Lei, Yongping (Lei, Yongping.) | Lin, Jian (Lin, Jian.) | Fu, Hanguang (Fu, Hanguang.) | Lin, Zipeng (Lin, Zipeng.)

Indexed by:

EI Scopus SCIE

Abstract:

Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball detection methods were hard to measure the diameter and roundness in an integrated and fast manner. Therefore, a new method and device for measuring the diameter and roundness of solder balls was proposed based on machine vision technology, including detection device and software design. The experimental device could detect the parameters of at least 40 solder balls at a time. The solder ball image was preprocessed in the software system to improve the quality of the solder ball image, and then the Harris operator successfully detected the concave point on the bonded solder ball image and realized the solder ball separation based on the shortest path matching criterion. Compared with the scanning electron microscope (SEM) measurement value, the diameter and roundness of solder balls measured by the detection system were smaller than 3%.

Keyword:

solder balls machine vision electronic packaging image processing

Author Community:

  • [ 1 ] [Wang, Tongju]North China Inst Aerosp Engn, Hebei Key Lab Micro Spacecraft Technol, Langfang 065000, Peoples R China
  • [ 2 ] [Liu, Yahao]North China Inst Aerosp Engn, Hebei Key Lab Micro Spacecraft Technol, Langfang 065000, Peoples R China
  • [ 3 ] [Zhang, Wenqian]North China Inst Aerosp Engn, Hebei Key Lab Micro Spacecraft Technol, Langfang 065000, Peoples R China
  • [ 4 ] [Lin, Zipeng]North China Inst Aerosp Engn, Hebei Key Lab Micro Spacecraft Technol, Langfang 065000, Peoples R China
  • [ 5 ] [Lei, Yongping]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 6 ] [Lin, Jian]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 7 ] [Fu, Hanguang]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Wang, Tongju]North China Inst Aerosp Engn, Hebei Key Lab Micro Spacecraft Technol, Langfang 065000, Peoples R China;;

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Source :

JOURNAL OF ELECTRONIC PACKAGING

ISSN: 1043-7398

Year: 2024

Issue: 2

Volume: 146

1 . 6 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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