In　this　research,　simulations　and　experiments　were　conducted　for　the　bonding　quality　evaluation　of　an　aluminum　bonding　structure,　based　on　the　SH　guided　wave　analysis.　In　order　to　simulate　the　propagation　of　SH　waves　in　the　bonded　structure,　a　3D　finite　element　model　was　established　based　on　interfacial　spring　stiffness　modeling.　The　frequency-wavenumber　diagram　was　obtained　by　doing　Fourier　transform　along　the　spatial　axis　in　the　time　frequency　domain　simulation　results.　At　the　same　time,　the　influence　of　the　bonding　interface　weakening　on　the　propagation　characteristics　of　the　guided　wave　was　analyzed.　The　simulated　dispersion　curves　of　SH-guided　waves　in　different　bonding　states　were　in　good　agreement　with　the　theoretically　results.　In　addition,　a　periodic　permanent　magnet　electromagnetic　acoustic　transducer　(PPM-EMAT)　3D　finite　element　model　was　established.　An　optimized　transducer　was　fabricated　to　excite　pure　SH0　mode.　Then,　a　series　of　aluminum　lap　bonding　structures　with　different　bonding　states　were　prepared.　The　effect　of　bonding　interfaces　on　the　propagation　characteristics　of　SH　waves　was　investigated.　The　interfacial　spring　stiffness　can　be　determined　when　the　STFT　of　the　SH　waves　matches　the　theoretical　dispersion　curves.　Thus,　this　method　demonstrated　an　ultrasonic　way　to　distinguish　the　weakening　of　the　bonding　structures.