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Author:

Wang, Yipeng (Wang, Yipeng.) | Zhang, Shuo (Zhang, Shuo.) | Li, Hong (Li, Hong.) | Hodulova, Erika (Hodulova, Erika.) | Li, Zhuoxin (Li, Zhuoxin.) | Cong, Baoqiang (Cong, Baoqiang.)

Indexed by:

EI Scopus SCIE

Abstract:

A 7075/5356 aluminum alloy laminated composite was fabricated by alternately depositing a 7075 wire and a 5356 wire layer by layer using wire arc additive manufacturing (WAAM). The microstructure and mechanical properties of the produced components under as -deposited and heat -treated conditions were investigated. The results revealed that the grain morphology of the specimen was mainly composed of equiaxed grains in each layer, while the grain size of the interlayer region was reduced due to the heterogeneous nucleation relying on the partially remelted previous layer. Moreover, a reduced amount of second phase was observed due to decreased Zn and Cu alloying elements content in this region, which resulted in a gradient change in microhardness distribution. The tensile strength and elongation of the heat -treated samples in vertical and horizontal directions were 321 MPa, 10.12 %, and 377 MPa, 9.72 %, respectively. The results indicated good comprehensive mechanical properties, which is promising for further application of WAAM fabricated laminated metal composite.

Keyword:

Metals and alloys Laminates Additive manufacturing Composite materials

Author Community:

  • [ 1 ] [Wang, Yipeng]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Zhang, Shuo]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Hong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Li, Zhuoxin]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Hodulova, Erika]Slovak Acad Sci, Inst Mat & Machine Mech, Bratislava 84513, Slovakia
  • [ 6 ] [Cong, Baoqiang]Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China

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Source :

MATERIALS LETTERS

ISSN: 0167-577X

Year: 2024

Volume: 367

3 . 0 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 9

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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