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Author:

Gao, Peng (Gao, Peng.) | Zhao, Xinlong (Zhao, Xinlong.) | Wang, Min (Wang, Min.) | Gao, Xiangsheng (Gao, Xiangsheng.) | Zan, Tao (Zan, Tao.) | Jing, Linkai (Jing, Linkai.)

Indexed by:

EI Scopus SCIE

Abstract:

In orthopaedic surgery, bone cutting may occur serious mechanical damage due to large crack propagation, which impedes patient postoperative recovery. Ultrasonic vibration assisted cutting (UVAC) has emerged as a leading technique in bone cutting owing to its remarkable advantages, including minimal damage and cutting force. However, how to diminish its damage during bone UVAC remains challenging. Hence, this study established a sophisticated model to calculate the energy release rate for cortical bone UVAC and predicted the critical cutting depths of shear and fracture crack propagation. This superiority stems from the synergistic effects of periodic tool separation and the acoustic softening effect inherent in UVAC, which contribute to a lower average energy release rate and a subsequently reduced cutting force. Nevertheless, the high instantaneous energy release rate during UVAC can exceed the material's critical threshold for crack propagation, leading to the initiation of microcracks and thereby inducing material embrittlement behaviour. These insights shed light on the material removal mechanism of bone UVAC in medical orthopaedic surgery, thus enriching our understanding and potentially guiding further advancements in this field.

Keyword:

Fracture mechanism Energy release rate Bone cutting Ultrasonic vibration cutting Crack propagation

Author Community:

  • [ 1 ] [Gao, Peng]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Zhao, Xinlong]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Wang, Min]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Gao, Xiangsheng]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Zan, Tao]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 6 ] [Jing, Linkai]Tsinghua Univ, Beijing Tsinghua Changgung Hosp, Dept Neurosurg, Beijing 102218, Peoples R China

Reprint Author's Address:

  • [Gao, Peng]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China;;[Jing, Linkai]Tsinghua Univ, Beijing Tsinghua Changgung Hosp, Dept Neurosurg, Beijing 102218, Peoples R China;;

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Source :

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

ISSN: 0924-0136

Year: 2024

Volume: 330

6 . 3 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 5

SCOPUS Cited Count: 4

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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