The　rapid　development　of　shear　bands　(SBs)　in　nanocrystalline　Cu　is　prone　to　lead　to　structural　failure,　while　coarse　crystalline　Cu　with　high　strain　hardening　capacity　can　effectively　inhibit　the　growth　of　SBs.　Heterogeneous　laminate　(HL)　has　a　structure　of　alternating　soft　and　hard　domains,　which　dramatically　increases　ductility　while　reducing　strength　loss.　In　this　work,　molecular　dynamics　(MD)　simulations　revealed　how　SBs　in　the　HL-Cu　during　the　stable　plastic　flow　stage　(the　applied　strain　of　10　similar　to　20　%)　strengthen　the　material.　It　is　suggested　that　when　SBs　are　uniformly　and　densely　distributed　in　the　structure,　the　strain　gradient　strengthening　effect　in　the　neighboring　regions　is　significantly　increased.　Moreover,　the　efficiency　of　strain　hardening　can　be　maximized　when　the　width　of　the　interface-affected-zone　(Defined　as　the　region　where　a　significant　linear　change　in　strain　occurs,　i.e.,　a　strain　gradient　exists,　located　at　the　junction　of　the　soft　and　hard　domains.)　caused　by　the　uneven　distribution　of　geometrically　necessary　dislocations　(GNDs)　is　exactly　the　same　as　the　layer　thickness.　The　results　show　that　the　strength　of　HL　can　be　increased　by　more　than　14　%　by　reducing　the　layer　thickness　by　half.