Welding characterization of polyhedral oligomeric silsesquioxane particles reinforced Sn-Ag based composite solder - 文章详情页

作者：

Zhen, Wen (Zhen, Wen.) | Tai, Feng (Tai, Feng.) | Guo, Fu (Guo, Fu.) (学者：郭福)

收录：

EI Scopus PKU CSCD

摘要：

Nano-sized　polyhedral　oligomeric　silsesquioxane-TriSilanol　cyclohexyl　(POSS)　particulates　reinforced　Sn-3.5Ag　composite　solder　joint　could　improve　mechanical　reliability.　The　3%　fraction　of　POSS　reinforcement　is　the　best　weight　fraction.　The　welding　characterization　of　POSS　reinforcement　in　3%　POSS/Sn-Ag　composite　solder　was　analyzed　through　differential　scanning　calorimeter　(DSC)　analysis　based　on　former　experimental　results　in　this　paper.　Results　indicate　that　the　welding　temperature　of　3%　POSS/Sn-Ag　composite　solder　is　similar　to　that　of　Sn-3.5Ag　eutectic　solder,　so　3%　POSS/Sn-Ag　composite　solder　has　acceptable　processing　property.　In　addition,　according　to　DSC　analysis,　3%　POSS/Sn-Ag　composite　solder　has　higher　activation　energy.　It　demonstrates　that　POSS　reinforcements　might　be　present　in　the　Sn　boundaries.

关键词：

Activation analysis Activation energy Binary alloys Differential scanning calorimetry Lead-free solders Oligomers Particle reinforced composites Reinforcement Welding

作者机构：

[ 1 ] [Zhen, Wen]Beijing Polytechnic, Beijing 100026, China
[ 2 ] [Tai, Feng]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Guo, Fu]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

通讯作者信息：

电子邮件地址：

taifeng@bjut.edu.cn

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至