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作者:

Qi, Haochun (Qi, Haochun.) | Zhang, Xiaoling (Zhang, Xiaoling.) | Xie, Xuesong (Xie, Xuesong.) | Zhao, Li (Zhao, Li.) | Chen, Chengju (Chen, Chengju.) | Lü, Changzhi (Lü, Changzhi.)

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摘要:

Considering the impacts of ideal factor n, VBEand band gap changes with the temperature on current gain, the current gain expression has been corrected to make the results closer to the actual test. Besides, the accelerating lifetime study method in the constant temperature - humidity stress is used to estimate the reliability of the same batch transistors. Applying the revised findings from the expression, the current gains before and after the test are compared and analyzed, and, according to the degradation data of the current gain, the transistor lifetimes in the test stress are respectively extrapolated in the different failure criteria. © 2014 Chinese Institute of Electronics.

关键词:

Bipolar transistors Transistors Amplification Energy gap

作者机构:

  • [ 1 ] [Qi, Haochun]Department of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 2 ] [Qi, Haochun]Chinese People's Liberation Army 68129 Troops, Lanzhou, China
  • [ 3 ] [Zhang, Xiaoling]Department of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 4 ] [Xie, Xuesong]Department of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 5 ] [Zhao, Li]Department of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 6 ] [Chen, Chengju]Department of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 7 ] [Lü, Changzhi]Department of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China

通讯作者信息:

  • [qi, haochun]chinese people's liberation army 68129 troops, lanzhou, china;;[qi, haochun]department of electronic information and control engineering, beijing university of technology, beijing, china

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来源 :

Journal of Semiconductors

ISSN: 1674-4926

年份: 2014

期: 9

卷: 35

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