Double-sided　cooling　(DSC)　IGBT　module　has　been　greatly　improved　in　heat　dissipation　performance　and　has　been　widely　used.　However,　the　heat　dissipation　efficiency　of　the　two　heat　paths　is　different,　which　will　reduces　the　service　life　and　reliability　of　the　module.　In　this　paper,　the　finite　element　Analysis　(FEA)　is　used　to　analyze　the　three-dimensional　heat　transfer　model　of　DSC　IGBT　module,　and　the　influence　of　the　material　layers　inside　DSC　IGBT　module　on　the　heat　dissipation　performance　is　researched.　The　results　were　analyzed　by　orthogonal　design.　The　results　show　that　the　height　and　material　of　spacer　have　great　influence　on　the　heat　dissipation　performance　of　DSC　IGBT　module,　but　the　influence　of　the　material　of　the　mold　compound　and　solder　is　not　obvious.　When　the　height　of　the　spacer　is　1.5mm,　the　spacer　material　is　Ag,　the　mold　compound　material　is　Phenolic　resin,　and　the　solder　material　is　Nano-silver　paste,　the　heat　dissipation　efficiency　of　the　two　heat　paths　of　the　DSC　IGBT　module　is　the　closest.