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作者:

Pan, Shijie (Pan, Shijie.) | Feng, Shiwei (Feng, Shiwei.) | Li, Xuan (Li, Xuan.) | Feng, Zixuan (Feng, Zixuan.) | Lu, Xiaozhuang (Lu, Xiaozhuang.) | Bai, Kun (Bai, Kun.) | Zhang, Yamin (Zhang, Yamin.)

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摘要:

In this study, the effects of 1 MeV electron radiation on the D-mode GaN-based high electron mobility transistors (HEMTs) were investigated after different radiation doses. The changes in electrical properties of the device were obtained, and the related physical mechanisms were analyzed. It indicated that under the radiation dose of 5 × 1014 cm−2, the channel current cannot be completely pinched off even if the negative gate voltage was lower than the threshold voltage, and the gate leakage current increased significantly. The emission microscopy and scanning electron microscopy were used to determine the damage location. Besides, the radiation dose was adjusted ranging from 5 × 1012 to 1 × 1014 cm−2, and we noticed that the drain−source current increased and the threshold voltage presented slightly negative shift. By calculations, it suggested that the carrier density and electron mobility gradually increased. It provided a reference for the development of device radiation reinforcement technology. © 2024 Chinese Institute of Electronics.

关键词:

Aluminum gallium nitride III-V semiconductors High electron mobility transistors Leakage currents Radiation damage Threshold current density Gallium nitride Junction gate field effect transistors Threshold voltage

作者机构:

  • [ 1 ] [Pan, Shijie]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Feng, Shiwei]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Li, Xuan]Institute of Microelectronics, Chinese Academy of Sciences, Beijing; 100029, China
  • [ 4 ] [Feng, Zixuan]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Lu, Xiaozhuang]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Bai, Kun]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 7 ] [Zhang, Yamin]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China

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来源 :

Journal of Semiconductors

ISSN: 1674-4926

年份: 2024

期: 9

卷: 45

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