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Providing an additional hole extraction path can significantly enhance the resistance to single-event radiation of SOI-LIGBT devices. This paper designs a 550 V Double RESURF SOI-LIGBT device and studies its single-event effects through simulation. The results indicate that the designed NCSP-LIGBT structure significantly improves resistance to single-event radiation without excessively sacrificing conduction performance. © Published under licence by IOP Publishing Ltd.
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ISSN: 1742-6588
年份: 2024
期: 1
卷: 2849
语种: 英文
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