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作者:

Liu, Xingyu (Liu, Xingyu.) | Dai, Yanwei (Dai, Yanwei.) (学者:代岩伟) | Kang, Rong (Kang, Rong.) | Zhao, Libo (Zhao, Libo.) | Qin, Fei (Qin, Fei.)

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摘要:

This paper utilizes the cohesive zone model (CZM) and method of numerical computation to conduct inverse analysis, leveraging the existing experimental results of Single-Leg Bending(SLB) tests of sintered silver joints with different metallization layers. Based on experimental data, numerical inverse analysis was conducted to determine the cohesive zone model (CZM) parameters for sintered silver joints with varying metallization layers. Initially, curves of load and displacement (P-delta) are directly obtained from the SLB tests. Subsequently, by analyzing these experimental data, the interfacial fracture toughness of the sintered silver joints with different metallization layers is determined. A two-dimensional finite element model (FEM) for the three-point bending of an SLB sample is developed. Ultimately, the cohesive zone model of the sintered silver joints with different metallization layers is established. The research findings demonstrate that the interfacial fracture toughness is highest when the metallization layer is Ni/Ag. The results suggest that the numerical solutions are in good agreement with the experimental data.

关键词:

Cohesive zone model(CZM) metallization layers Sintered silver Numerical simulation

作者机构:

  • [ 1 ] [Liu, Xingyu]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 2 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 3 ] [Kang, Rong]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 4 ] [Zhao, Libo]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 5 ] [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China

通讯作者信息:

  • 代岩伟

    [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China

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来源 :

2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT

ISSN: 2836-9734

年份: 2024

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