Large　area　interposer　provides　a　bridge　between　different　packaging　levels　and　components,　enabling　the　entire　packaging　system　to　achieve　higher　performance　and　functional　density.　This　study　uses　a　combination　of　multiple　field　exposures　to　generate　fine　pitch　Redistribution　Layer　(RDL)　for　large　area　interposer.　RDL　spaces　with　widths　ranging　from　1.5　to　10　tm　are　evaluated　based　on　their　ability　to　accommodate　the　critical　dimension　(CD)　that　the　RDL　distributed　at　the　stitching.　In　parallel,　two　distinct　Damascus　process　flows　have　been　compared　to　improve　the　parameters　of　Deep　Reactive　Ion　Etching　(DRIE)　procedures.　Compared　to　semi-additive　processes　that　produce　reliability　difficulties　such　as　undercut　following　wet　etching,　utilizing　inorganic　thin　films　as　dielectric　layers　can　improve　RDL　dependability.　Meanwhile,　the　experiments　indicated　that　the　dielectric　layer　with　inorganic　thin　films　could　offer　advantages　in　high　frequency　signal　integrity.