Diffusion bonding of a Zr-based metallic glass in its supercooled liquid region - 文章详情页

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摘要：

Based　on　the　analyses　of　the　influences　of　temperature　and　pressure　on　diffusion　behavior　with　time,　a　Zr-based　bulk　metallic　glass　is　successfully　bonded　in　its　supercooled　liquid　region.　The　temperature　is　found　to　be　a　key　factor　for　the　success　of　the　bonding　process　if　sufficient　pressure　and　time　are　adopted.　Three-point　bending　tests　show　that　the　flexural　performance　of　the　samples　bonded　with　various　parameters　is　significantly　different.　The　parameters　in　favor　of　diffusion　bonding　do　not　automatically　benefit　the　performance　of　the　bonded　materials.　Diffusion　makes　the　nano-voids　shrink　to　form　metallurgical　bonding　at　the　interface　and　it　causes　structural　relaxation　leading　to　the　embrittlement　inside　bulk.　Balance　between　the　two　aspects　is　the　key　to　the　bonding　success　and　the　utility　of　the　bonded　materials.　©　2013　Elsevier　Ltd.　All　rights　reserved.

关键词：

Supercooling Cryogenic liquids Diffusion bonding Bending tests Metallic glass Glass Glass bonding Diffusion Metals

作者机构：

[ 1 ] [Wang, J.G.]Advanced Manufacturing Technology Research Centre, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Hung Hom, Hong Kong
[ 2 ] [Wang, J.G.]School of Materials Science and Engineering, Anhui University of Technology, Ma'anshan 243002, China
[ 3 ] [Fan, J.C.]School of Materials Science and Engineering, Anhui University of Technology, Ma'anshan 243002, China
[ 4 ] [Zhang, Y.F.]Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Wang, G.]Laboratory for Microstructures, Shanghai University, Shanghai 200444, China
[ 6 ] [Wang, W.H.]Institue of Physics, Chinese Academy of Sciences, Beijing 100190, China
[ 7 ] [Chan, K.C.]Advanced Manufacturing Technology Research Centre, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Hung Hom, Hong Kong

通讯作者信息：

[chan, k.c.]advanced manufacturing technology research centre, department of industrial and systems engineering, hong kong polytechnic university, hung hom, hong kong

电子邮件地址：

kc.chan@polyu.edu.hk

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