Crosstalk-free 3D IC TSV automatic placement - 文章详情页

作者：

收录：

EI Scopus PKU CSCD

摘要：

A　crosstalk-free　3D　IC　through　silicon　via　(TSV)　automatic　placement　algorithm　is　presented　in　this　paper.　The　principle　of　TSV　crosstalk　and　the　effectiveness　of　grounded　TSV　shielding　was　proved　by　using　Comsol.　Then　effectiveness　of　grounded　TSV　was　quantified　with　a　deduced　formula.　Power/Ground　TSV　and　signal　TSV　placement　algorithm　has　been　realized,　considering　the　impact　of　TSV　percentage　and　pinch　constraint　on　3D　IC　performance.　Finally,　the　experimental　results　on　IBM　benchmark　circuits　validated　and　verified　the　proposed　algorithm.

关键词：

Integrated circuit interconnects Electronics packaging Crosstalk Timing circuits Three dimensional integrated circuits

作者机构：

[ 1 ] [Hou, Ligang]VLSI and System Laboratory, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Li, Chunqiao]VLSI and System Laboratory, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Bai, Shu]VLSI and System Laboratory, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Wang, Jinhui]VLSI and System Laboratory, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Diao, Luhong]Department of Applied Math and Physics, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Liu, Weiping]Huada Empyrean Software Co., Ltd., Beijing 100102, China

通讯作者信息：

电子邮件地址：

houligang@bjut.edu.cn

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至