The　intermetallic　compound　(IMC)　play　an　important　role　in　the　electronic　packaging,　which　is　a　sign　of　reliable　bonding.　Nevertheless,　thicker　IMC　layers　exert　detrimental　influence　on　the　bonding　reliability　for　its　intrinsic　brittleness.　Hence,　it　is　meaningful　to　probe　the　property　of　the　IMC　layers.　In　this　study,　technique　for　testing　the　IMC　property　were　reviewed　and　some　results　were　listed,　which　mainly　consisted　of　the　hardness,　modulus,　yield　strength　and　coefficient　of　thermal　expand,　etc.