Nanoindentation properties of intermetallic compounds in lead-free solder joints - 文章详情页

作者：

Qin, Fei (Qin, Fei.) (学者：秦飞) | An, Tong (An, Tong.) | Zhong, Weixu (Zhong, Weixu.) | Liu, Chengyan (Liu, Chengyan.)

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摘要：

The　growth　of　intermetallic　compounds　(IMC)　at　the　Sn3.0Ag0.5Cu/Cu　interface　was　investigated　under　isothermal　aging　temperature　of　150°C　and　aging　time　of　100,　300,　500　and　1000　h,　respectively.　The　relationship　between　the　thickness　of　the　IMCs　layer　and　aging　time　was　fitted　out,　and　the　growth　law　of　the　IMCs　layer　at　Sn3.0Ag0.5Cu/Cu　interface　under　isothermal　aging　condition　was　obtained.　Mechanical　properties　of　the　Cu6Sn5　and　Cu3Sn　were　obtained　by　a　nanoindentation　tester.　It　indicates　that　with　the　Cu6Sn5　thickness　increasing,　its　Young＇s　modulus　and　hardness　have　no　significant　change.　The　Young＇s　modulus　of　Cu3Sn　is　greater　than　that　of　Cu6Sn5,　but　the　hardness　of　Cu3Sn　is　lower　than　that　of　Cu6Sn5.　The　nanoindentation　experiments　of　the　Sn3.0Ag0.5Cu/Cu　interfacial　zone　show　that　the　hardness　of　Cu,　Cu3Sn,　Cu6Sn5　and　Sn3.0Ag0.5Cu　has　an　order　of　magnitude　that　is　in　sequence　Cu6Sn5＞Cu3Sn　＞　Cu＞Sn3.0Ag0.5Cu.

关键词：

Binary alloys Copper alloys Elastic moduli Electronics packaging Hardness Intermetallics Isotherms Lead-free solders Mechanical properties Nanoindentation Silver alloys Soldered joints Ternary alloys Tin alloys

作者机构：

[ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Zhong, Weixu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Liu, Chengyan]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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电子邮件地址：

qfei@bjut.edu.cn

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