Rate-dependent constitutive model for lead-free solders considering damage effect - 文章详情页

作者：

Qin, Fei (Qin, Fei.) (学者：秦飞) | An, Tong (An, Tong.) | Wang, Xu-Ming (Wang, Xu-Ming.)

收录：

EI Scopus PKU CSCD

摘要：

In　this　paper,　the　damage　effect　was　considered　into　the　impact　process　of　lead-free　solder　specimens.　Based　on　the　experimental　data,　the　modified　rate-dependent　Johnson-Cook　model　for　the　Sn3.0Ag0.5Cu　and　Sn3.5Ag　lead-free　solders　were　derived.　The　stress-strain　curves　obtained　from　the　modified　Johnson-Cook　material　models　and　the　experiments　agreed　quite　well　with　each　other.　It　indicates　that　presented　modified　Johnson-Cook　models　are　suitable　to　describe　the　dynamic　behavior　of　the　two　lead-free　solder　materials.

关键词：

Binary alloys Copper alloys Lead-free solders Silver alloys Stress-strain curves Ternary alloys Tin alloys

作者机构：

[ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Wang, Xu-Ming]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

通讯作者信息：

电子邮件地址：

qfei@bjut.edu.cn

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至