• 综合
  • 标题
  • 关键词
  • 摘要
  • 学者
  • 期刊-刊名
  • 期刊-ISSN
  • 会议名称
搜索

作者:

Yang, Yu'e (Yang, Yu'e.) | He, Cunfu (He, Cunfu.) (学者:何存富) | Wu, Bin (Wu, Bin.)

收录:

EI Scopus PKU CSCD

摘要:

Based on the propagation characteristics of microwave and the microwave sensitivity to the interface, the phase difference at the interface of thermal barrier coating(TBC) and waveguide probe was used to characterize the long crack on the metal substrate surface under TBC using computer simulation technology-microwave studio (CST-MWS). The influences of top coating thickness and crack direction were studied. Besides, microwave evaluation of cracks with different width and the crack length direction parrallel to the long brim of the rectangular waveguide probe were studied when the thickness of TBC is 400 μm. The results show that the top coating thickness affects the sensitive frequency, and that the carck direction influences the evaluation sensitive, and the evaluation sensitive is the minimum when the angle between the rack length direction and the long brim of the rectangular waveguide probe is 50°-55°. It is also observed that the crack can not be detected when the crack width is less than 8 μm, and the effect of detection is not obvious when the crack width is 10-30 μm, and the wider the cracks, the greater the phase difference of the reflection coefficient when crack width is in the range of 30 μm-1 mm. Therefore, it is feasible to evaluate the crack on the metal substrate surface using microwave non-destruction evaluation.

关键词:

Microwaves Rectangular waveguides Surface defects Thickness measurement Probes Cracks Thermal barrier coatings

作者机构:

  • [ 1 ] [Yang, Yu'e]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Yang, Yu'e]Physics and Information Engineering Department, Jining University, Qufu 273155, Shandong, China
  • [ 3 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

通讯作者信息:

电子邮件地址:

查看成果更多字段

相关关键词:

来源 :

Acta Materiae Compositae Sinica

ISSN: 1000-3851

年份: 2013

期: 3

卷: 30

页码: 149-153

被引次数:

WoS核心集被引频次: 0

SCOPUS被引频次:

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

近30日浏览量: 0

在线人数/总访问数:250/3907923
地址:北京工业大学图书馆(北京市朝阳区平乐园100号 邮编:100124) 联系我们:010-67392185
版权所有:北京工业大学图书馆 站点建设与维护:北京爱琴海乐之技术有限公司