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AlxGa1-xN/AlN/GaN high electron mobility transistor (HEMT) materials with different Al compositions (x=0.19, 0.22, 0.25, 0.32) were grown on sapphire substrates by metalorganic chemical vapor deposition (MOCVD). The effects of Al composition on electrical and structural properties of HEMTs materials were analyzed. It is observed that two-dimensional electron gas (2DEG) density and mobility are improved with the raising of Al content within a certain range. However, too high Al composition will make the surface turn to be rougher and the mobility deteriorate, which was reinforced by the test results of atomic force microscopy (AFM). The optimum Al content is 25%. Based on this, the HEMT materials showed a high 2DEG density of 1.2×1013 cm-2 with a low sheet resistance of 310 Ω/, and highly Hall mobility of 1680 cm2/(V·s) at room temperature.
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