Finite element simulation of PoP assembly process - 文章详情页

作者：

Qin, Fei (Qin, Fei.) (学者：秦飞) | Ren, Chao (Ren, Chao.)

收录：

EI Scopus PKU CSCD

摘要：

Package　on　package　(PoP)　is　a　widely　used　3D　packaging　technology.　In　this　paper,　a　finite　element　approach　is　proposed　to　simulate　the　entire　assembly　process　of　a　PoP　component　through　the　techniques　of　element　die　and　birth　as　well　as　restart　in　ABAQUS,　and　the　approach　is　applicable　to　transfer　stress　and　warpage　in　one　process　to　the　next　so　that　the　evolution　of　stresses　and　warpages　during　assembly　can　be　predicted.　Simulation　results　show　that　the　approach　is　feasible　and　effective.

关键词：

ABAQUS Assembly Electronics packaging Finite element method Packaging

作者机构：

[ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Ren, Chao]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

通讯作者信息：

电子邮件地址：

qfei@bjut.edu.cn

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