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Author:

Miao, Yan-Ling (Miao, Yan-Ling.) | Qiao, Xiao-Jing (Qiao, Xiao-Jing.) | Li, Wang-Chang (Li, Wang-Chang.) | Ren, Qing-Guo (Ren, Qing-Guo.) | Sun, Zhi-Gang (Sun, Zhi-Gang.)

Indexed by:

EI Scopus PKU CSCD

Abstract:

The application of heat transfer technology to control the delay time of using second level delay composition is researched in this work. Experiments were carried out to investigate the factors of affecting delay time of the metal clapboard equipment in which the tungsten type delay composition was used as the energy input one. Numerical simulation was implemented using ANSYS software and its results were compared with the experimental ones. The research findings show that, during the heat transfer, the second ignition composition is ignited at the center of the clapboard output terminal. The 5 s ignition temperature of the second ignition composition is 189.33°C, which is relatively low and is easy to be ignited. Also, it is found that the bigger the charge density is, the more accurate the delay time is. When the charge density changes from 3.2 g/cm3 to 4.0 g/cm3, the relative error of delay time is decreased from 11.2% to1.6%. Moreover, by Origin numerical fitting method, the relation of delay time with the thickness of metal clapboard is a quadratic function.

Keyword:

Heating equipment Heat transfer Numerical methods Numerical models Computer software

Author Community:

  • [ 1 ] [Miao, Yan-Ling]School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
  • [ 2 ] [Miao, Yan-Ling]Department of Science and Technology, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Qiao, Xiao-Jing]School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
  • [ 4 ] [Li, Wang-Chang]School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
  • [ 5 ] [Ren, Qing-Guo]School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
  • [ 6 ] [Sun, Zhi-Gang]School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China

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Source :

Transaction of Beijing Institute of Technology

ISSN: 1001-0645

Year: 2012

Issue: 4

Volume: 32

Page: 348-353

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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