Analysis for microstructure and mechanical property of Sn-3Ag-0.5Cu solder joints in high density LED packages - 文章详情页

作者：

Wang, Xinxin (Wang, Xinxin.) | Liu, Jianping (Liu, Jianping.) | Guo, Fu (Guo, Fu.) (学者：郭福) | Liu, Li (Liu, Li.) | Lei, Yuanhong (Lei, Yuanhong.)

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摘要：

The　microstructure　of　Sn37Pb　and　Sn3Ag0.5Cu　solder　joints　under　as-reflowed　and　isothermal　aged　conditions　were　observed　respectively.　The　shear　strength　of　samples　were　also　measured.　The　results　suggested　that　despite　the　IMC　layer　of　the　Sn37Pb　solder　joints　was　thicker　than　the　Sn3Ag0.5Cu　solder　joints,　both　of　them　were　within　the　acceptable　range.　The　Sn3Ag0.5Cu　solder　joints　shows　a　bigger　shear　strength　due　to　its　special　structure　of　β-Sn　primary　crystal　coated　by　reticular　eutectic.　Besides,　the　shear　strength　of　the　two　solder　joints　decreased　after　aging.　Although　lead-free　solder　is　the　inevitable　trend　to　the　development　of　electronic　packaging　industry　instead　of　Sn37Pb　solder,　precision　reflowing　process　still　plays　an　important　role　to　improve　the　quality　of　the　solder　joints.

关键词：

Binary alloys Copper alloys Crystal structure Electronics packaging Eutectics Lead-free solders Light emitting diodes Mechanical properties Microstructure Shear strength Silver alloys Soldered joints Ternary alloys Tin alloys

作者机构：

[ 1 ] [Wang, Xinxin]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Liu, Jianping]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Guo, Fu]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Liu, Li]R and D Center, Beijing Leyard Electronic Science Technology Co., Ltd, Beijing 100091, China
[ 5 ] [Lei, Yuanhong]R and D Center, Beijing Leyard Electronic Science Technology Co., Ltd, Beijing 100091, China

通讯作者信息：

电子邮件地址：

guofu@bjut.edu.cn

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