In　this　paper,　tungsten　coatings　on　copper　substrates　were　prepared　by　electro-deposition　from　a　Na2WO4　molten　salt　system　at　1173K.　The　coating　composition,　microstructure,　and　morphology　were　studied　via　XRD,　SEM,　EDS,　and　LSCM.　The　electrochemical　reduction　mechanism　of　W6+　in　the　Na2WO4　system　was　investigated　by　cyclic　voltammetry　and　square　wave　voltammetry.　The　results　demonstrate　that　the　tungsten　coatings　obtained　under　different　process　parameters　are　free　from　impurities.　At　a　current　density　of　20　mA/cm(2),　the　tungsten　coating　shows　no　apparent　crystal　plane　orientation,　and　a　dense　tungsten　coating　with　a　preferred　orientation　along　the　(211)　plane　is　obtained　as　the　current　density　increases.　As　the　electrodeposition　duration　increases,　the　(211)　crystal　plane　texture　coefficient　increases.　The　tungsten　reduction　process　in　the　molten　salt　system　at　1173　K　follows　a　two-steps　reaction,　W(VI)-＞　W(IV)-＞　W.