A heat transfer device combined with vapor-chamber and micro flat heat pipe array - 文章详情页

作者：

Wang, Hong-Yan (Wang, Hong-Yan.) | Hao, Li-Min (Hao, Li-Min.) | Zhao, Yao-Hua (Zhao, Yao-Hua.) (学者：赵耀华) | Diao, Yan-Hua (Diao, Yan-Hua.)

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摘要：

The　heat　transfer　characteristic　of　a　heat-exchange　device　which　is　combined　with　a　vapor　chamber　and　a　micro　tube　array　was　studied.　This　combined-type　device　has　been　used　for　high　power　LED　heat　dissipation.　It　not　only　has　ultra　high　critical　heat　flux　(CHF)　but　also　has　an　isotropous　heat　transfer　characteristic.　It　is　an　effective　way　to　solve　the　heat　dissipation　problems　in　high　heat　flux　and　other　extreme　conditions,　especially　passive　heat　dissipation　aspects.

关键词：

Heat flux Heat losses Heat pipes Light emitting diodes Heat transfer

作者机构：

[ 1 ] [Wang, Hong-Yan]College of Architecture and Civil Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Hao, Li-Min]College of Architecture and Civil Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Zhao, Yao-Hua]College of Architecture and Civil Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Diao, Yan-Hua]College of Architecture and Civil Engineering, Beijing University of Technology, Beijing 100124, China

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