Based　on　the　latest　four　international　conferences　on　welding　and　joining　technologies　held　in　the　past　three　years,　the　latest　advances　in　brazing　and　soldering　technologies　were　concluded.　Many　useful　research　results　have　been　achieved　in　the　aspects　of　new　solder　for　light-weight　alloys　(such　as　titanium　alloys,　aluminum　alloys,　magnesium　alloys),　and　low-temperature　fillers　including　Sn-based　Pd-free　solder　and　Au-Ge　system　filler,　as　well　as　high-temperature　fillers　for　ceramic　joining.　Reactive　air　brazing　method　was　applied　in　the　study　on　ceramic　joining　and　some　new　progress　has　been　indeed　made.　The　study　on　the　nano-composite　filler　for　Mo/Mo-Re　alloys　and　the　diffusion　bonding　using　nano-layered　foil　are　novel.　Reviews　and　comments　were　made　on　research　advances　on　the　special　brazing　technologies　such　as　ultrasonic　induction　brazing,　arc　brazing,　and　plasma　brazing.　Some　special　joining　technologies　have　been　put　into　engineering　application.　Furthermore,　the　computer　numerical　simulation　technology　has　been　developed　to　reveal　the　phenomenon　and　mechanism　in　brazing　processes,　such　as　the　molecular　dynamics　simulation　of　wetting　phenomena　and　FE　modeling　of　stress　field　and　temperature　field　in　the　brazed　joints.