Turning mechanism for tin whisker growth - 文章详情页

作者：

收录：

EI Scopus PKU CSCD

摘要：

The　growth　behavior　of　tin　whiskers　on　the　surface　of　the　oxidized　RE-Sn　phase　was　investigated　in　order　to　fully　understand　the　nature　of　whisker　growth　phenomenon　and　establish　its　growth　mechanism.　The　results　indicate　that　large　amounts　of　tin　whiskers　are　formed　on　the　oxidized　RE-phases　during　the　storage,　some　of　which　change　the　growth　direction　continuously,　in　particular,　the　diameter　of　some　tin　whiskers　can　be　also　changed　during　the　turning　growth.　The　change　of　stress　state　around　tin　whisker　root　results　in　the　growth　direction　change　and　the　incoordination　between　the　growth　rate　and　the　tin　atoms　supply　results　in　the　cross　section　change.

关键词：

Crystal whiskers Lead-free solders Rare earths Tin

作者机构：

[ 1 ] [Hao, Hu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Shi, Yao-Wu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Xia, Zhi-Dong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Lei, Yong-Ping]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Guo, Fu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Li, Xiao-Yan]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

通讯作者信息：

电子邮件地址：

haohu@emails.bjut.edu.cn

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至