Effect　of　loading　rate　on　shear　strength　and　fracture　mode　of　SnAgCu　(SAC)　lead-free　solder　joint　was　investigated.　The　Ag　content　of　the　solders　used　in　the　experiment　was　1%　to　3%.　The　loading　rate　of　the　solder　joint　was　0.01　mm/s　to　10　mm/s.　The　results　indicated　that　the　shear　strength　increased　with　the　increase　of　loading　rate　and　fracture　with　ductile　feature　occured　inside　the　solder,　when　the　loading　rate　was　less　than　1　mm/s.　When　loading　rate　reached　to　10　mm/s,　the　shear　strength　decreased　and　brittle　fracture　occurred　in　the　intermetallic　compounds　layer　of　joint.　Moreover,　shear　strength　increased　with　Ag　content　of　solder　increased　at　low　loading　rate,　while　the　shear　strength　of　solder　joint　with　2%　Ag　was　the　lowest　at　high　loading　rate.