Effects of electroless nickel immersion gold protective finish of Cu on the reliability of the lead-free solder joint - Details

Author：

Zhang, Ruihong (Zhang, Ruihong.) | Zhao, Ran (Zhao, Ran.) | Guo, Fu (Guo, Fu.) (Scholars：郭福)

Indexed by：

EI Scopus PKU CSCD

Abstract：

The　effects　of　Electroless　nickel　immersion　gold　(ENIG)　on　the　interfacial　reaction　and　solder　joints＇　reliability　was　investigated　in　this　paper.　The　results　show　that　(NiyCu1-y)3Sn4　forms　at　the　Sn-3.5Ag/ENIG　(Ni)/Cu,　while　(CuxNi1-x)6Sn5　forms　at　the　Sn-3.0Ag-0.5Cu/ENIG/Cu　during　the　reflow.　The　composition　and　morphology　of　the　interfacial　intermetallic　compounds　(IMCs)　show　strong　dependency　on　the　Cu　concentration　in　the　solder　joint.　The　Ni　layer　in　the　ENIG　can　retard　the　excessive　growth　of　interfacial　IMCs　which　is　the　culprit　of　the　solder　joints＇　failure　during　aging.　The　Au　layer　in　ENIG　exerts　little　influence　on　the　interfacial　reaction　but　reacts　with　Sn　in　the　solder　matrix　during　the　reflow.　In　the　stage　of　aging　the　Au　migrates　towards　the　interface　and　in　turn　changes　the　composition　of　the　interfacial　IMCs　as　well　as　the　shear　strength　of　the　solder　joint.　©Copyright.

Keyword：

Soldered joints Nickel Copper Gold Packaging materials Electronics packaging Soldering Lead-free solders Surface chemistry

Author Community：

[ 1 ] [Zhang, Ruihong]The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Zhao, Ran]The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Guo, Fu]The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

Reprint Author's Address：

Email：

guofu@bjut.edu.cn

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Related Keywords：

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Source ：

Chinese Journal of Materials Research

ISSN： 1005-3093

Year： 2010

Issue： 2

Volume： 24

Page： 137-143

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 0

Affiliated Colleges：

材料与制造学部材料科学与工程学院

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