Effects of electroless nickel immersion gold protective finish of Cu on the reliability of the lead-free solder joint - 文章详情页

作者：

Zhang, Ruihong (Zhang, Ruihong.) | Zhao, Ran (Zhao, Ran.) | Guo, Fu (Guo, Fu.) (学者：郭福)

收录：

EI Scopus PKU CSCD

摘要：

The　effects　of　Electroless　nickel　immersion　gold　(ENIG)　on　the　interfacial　reaction　and　solder　joints＇　reliability　was　investigated　in　this　paper.　The　results　show　that　(NiyCu1-y)3Sn4　forms　at　the　Sn-3.5Ag/ENIG　(Ni)/Cu,　while　(CuxNi1-x)6Sn5　forms　at　the　Sn-3.0Ag-0.5Cu/ENIG/Cu　during　the　reflow.　The　composition　and　morphology　of　the　interfacial　intermetallic　compounds　(IMCs)　show　strong　dependency　on　the　Cu　concentration　in　the　solder　joint.　The　Ni　layer　in　the　ENIG　can　retard　the　excessive　growth　of　interfacial　IMCs　which　is　the　culprit　of　the　solder　joints＇　failure　during　aging.　The　Au　layer　in　ENIG　exerts　little　influence　on　the　interfacial　reaction　but　reacts　with　Sn　in　the　solder　matrix　during　the　reflow.　In　the　stage　of　aging　the　Au　migrates　towards　the　interface　and　in　turn　changes　the　composition　of　the　interfacial　IMCs　as　well　as　the　shear　strength　of　the　solder　joint.　©Copyright.

关键词：

Copper Electronics packaging Gold Lead-free solders Nickel Packaging materials Soldered joints Soldering Surface chemistry

作者机构：

[ 1 ] [Zhang, Ruihong]The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Zhao, Ran]The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Guo, Fu]The College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

通讯作者信息：

电子邮件地址：

guofu@bjut.edu.cn

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