Experimental　study　on　the　cooling　capacity　for　the　high　power　LED　lighting　array　by　using　the　new　type　flat　plate　heat　pipe　are　carried　out.　The　cooling　device　for　high　power　LED　light　array　are　designed　and　constructed.　It　is　found　that　compares　with　the　LED　light　system　without　heat　pipes,　the　LED　light　system　with　the　new　type　of　cooling　device　based　on　the　flat　heat　pipe　works　better.　The　chip　junction　temperature　of　high　power　LED　lighting　system　which　with　flat　plate　heat　pipe　is　about　5_C　lower　than　the　one　without　flat　plate　heat　pipe,　and　the　former　has　a　more　uniform　temperature　distribution,　which　is　faster　to　achieve　stable.　Also,　this　kind　of　cooling　device　is　light,　smart　and　compact　and　has　low　thermal　resistance.