Study on creep characterization of nano-sized Ag particle-reinforced Sn-Pb composte solder joints - 文章详情页

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摘要：

In　the　present　work,　the　creep　strain　of　solder　joints　is　measured　using　a　stepped　load　creep　test　on　a　single　specimen.　Based　on　the　experimental　results,　the　constitutive　model　on　the　steady-state　creep　strain　is　established　by　applying　a　linear　curve　fitting　for　the　nano-sized　Ag　particle-reinforced　Sn37Pb　based　composite　solder　joint　and　the　Sn37Pb　solder　joint,　respectively.　It　is　indicated　that　the　activation　energy　of　the　Ag　particle-reinforced　Sn37Pb　based　composite　solder　joints　is　higher　than　that　of　Sn37Pb　solder　joints.　It　is　expected　that　the　creep　resistance　of　the　Ag　particle-reinforced　Sn37Pb　based　composite　solder　joints　is　superior　to　that　of　Sn37Pb　solder.　©　2009　Springer　Science+Business　Media,　LLC.

关键词：

Silver Particle reinforced composites Activation energy Binary alloys Tin alloys Lead alloys Creep resistance Reinforcement Curve fitting Creep testing Creep

作者机构：

[ 1 ] [Shi, Yaowu]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
[ 2 ] [Liu, Jianping]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
[ 3 ] [Xia, Zhidong]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
[ 4 ] [Lei, Yongping]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
[ 5 ] [Guo, Fu]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
[ 6 ] [Li, Xiaoyan]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China

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shiyw@bjut.edu.cn

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