A　thermal　conductivity　and　insulating　adhesive　was　prepared　by　diamond　particle,　epoxy　resin　(E-20),　methanol　etherified　amino　resin　and　additives.　The　adhesive　was　cured　by　drying　at　130°C　for　30minutes　and　then　at　210°C　for　10minutes.　The　thermal　conductivity　coefficient　when　the　cured　adhesive　shows　a　transition　from　increasing　to　decreasing　with　the　increasing　of　the　diamond　particle　volume　content　in　the　adhesive.　Diamond　particles　with　large　size　can　enlarge　physical　contact　area　between　diamond　particles,　which　improve　the　thermal　conductivity　of　the　cured　adhesive.　The　thermal　conductivity　of　the　cured　adhesive　was　simulated　by　the　commonly　used　empirical　models.　The　simulation　results　indicated　that　the　Maxwell　equation　was　in　accordance　with　the　thermal　conductivity　coefficient　when　the　cured　adhesive　with　the　volume　ratio　of　the　diamond　particle　was　less　than　16.6%,　while　Bruggeman　model　and　Agari　model　were　in　agreement　with　the　experimental　data　when　the　cured　adhesive　with　the　volume　ratio　of　the　diamond　particle　was　from　16.6%　to　44.7%.