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Author:

Zhang, H. H. (Zhang, H. H..) | Liu, S. M. (Liu, S. M..) | Han, S. Y. (Han, S. Y..) | Fan, L. F. (Fan, L. F..) (Scholars:范立峰)

Indexed by:

EI Scopus SCIE

Abstract:

Due to its dual cover systems (i.e., the mathematical cover and the physical cover), the numerical manifold method (NMM) is outstanding in crack modeling, especially in the simulation of complex cracks. In this paper, the NMM is extended to calculate the T-stresses for two-dimensional multiple-branched and intersecting cracks. The displacement jump across crack surface is essentially portrayed by the NMM, and the stress singularity at the crack tip is represented through the incorporation of related asymptotic basis in the NMM local functions. The T-stresses are extracted with the domain-form interaction integral in the NMM postprocessing. To validate the proposed scheme, three numerical examples are tested on uniform mathematical covers nonconforming with all domain boundaries, and the computed results are in nice consistence with the existing solutions. Besides, the effects of crack configurations and boundary conditions on the T-stresses are also revealed.

Keyword:

Multiple-branched and intersecting cracks T-stress Interaction integral Numerical manifold method

Author Community:

  • [ 1 ] [Zhang, H. H.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 2 ] [Liu, S. M.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 3 ] [Han, S. Y.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 4 ] [Fan, L. F.]Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100084, Peoples R China

Reprint Author's Address:

  • 范立峰

    [Fan, L. F.]Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100084, Peoples R China

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Source :

ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS

ISSN: 0955-7997

Year: 2019

Volume: 107

Page: 149-158

3 . 3 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 18

SCOPUS Cited Count: 22

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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