Dynamic mechanical properties of lead-free solders - 文章详情页

作者：

Qin, Fei (Qin, Fei.) (学者：秦飞) | Chen, Na (Chen, Na.) | Hu, Shi-Sheng (Hu, Shi-Sheng.)

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摘要：

The　dynamic　mechanical　properties　of　63Sn37Pb,　96.5Sn3.5Ag　and　96.5Sn3.0Ag0.5Cu　have　been　investigated　at　high　strain　rate　by　using　the　split　Hopkinson　pressure/tensile　bar　technique.　Stress-strain　curves　of　the　three　materials　were　obtained　at　strain　rates,　ranging　from　600　s-1　to　2200　s-1.　The　experimental　results　show　that　all　the　three　materials　are　strongly　strain　rate　dependent,　of　which　96.5Sn3.5Ag　is　relative　more　sensitive　to　strain　rate,　while　at　the　same　strain　rate　96.5Sn3.0Ag0.5Cu　has　the　greatest　yield　and　ultimate　tensile　stresses.

关键词：

Binary alloys Copper alloys Dynamics Lead-free solders Silver alloys Strain rate Stress-strain curves Ternary alloys Tin alloys

作者机构：

[ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Chen, Na]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Hu, Shi-Sheng]School of Engineering Science, University of Science and Technology of China, Hefei 230026, China

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