Effects of Ni/P/Ce on oxidation resistance and solidification crack of SnAgCu lead free solder alloy - 文章详情页

作者：

Dong, Wenxing (Dong, Wenxing.) | Shi, Yaowu (Shi, Yaowu.) | Xia, Zhidong (Xia, Zhidong.) | Lei, Yongping (Lei, Yongping.) (学者：雷永平)

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摘要：

The　effect　of　adding　trace　elements　of　Ni,　P　and　Ce　on　the　oxidation　resistance　and　solidification　crack　of　SAC305　solder　alloys　is　investigated.　Experimental　results　indicate　that　adding　Ni　can　decrease　the　length　of　solidification　crack　and　depress　the　formation　of　the　crack,　but　can　not　improve　the　oxidation　resistance　of　SAC305　solder　alloy.　Trace　P　addition,　which　forms　a　dense　oxidation　barrier　on　the　surface　of　the　solder,　can　improve　the　oxidation　resistance　of　solder,　but　aggravates　the　formation　of　solidification　crack　on　the　surface　of　solder　alloys.　Addition　of　Ce　can　deteriorate　the　oxidation　resistance　of　SAC305　solder　alloy　and　slightly　depress　the　solidification　crack　on　the　surface　of　the　alloys.

关键词：

Cerium Cerium alloys Copper alloys Lead-free solders Oxidation resistance Silver alloys Solidification Ternary alloys Tin alloys Trace elements

作者机构：

[ 1 ] [Dong, Wenxing]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Shi, Yaowu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Xia, Zhidong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Lei, Yongping]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

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电子邮件地址：

dongwenxing@emails.bjut.edu.cn

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