Morphologies and characteristics of tin whiskers on surface of SnAgCuCe/Er lead-free solder - 文章详情页

作者：

Hao, Hu (Hao, Hu.) | Li, Guangdong (Li, Guangdong.) | Shi, Yaowu (Shi, Yaowu.) | Lei, Yongping (Lei, Yongping.) (学者：雷永平)

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EI Scopus PKU CSCD

摘要：

Large　sized　CeSn3　and　ErSn3　phases　precipitated　in　the　Sn-3.8Ag-0.7Cu-1.0Ce/Er　solder　alloy　are　oxidized　when　they　are　exposed　in　air,　and　tin　whiskers　can　rapidly　grow　on　the　surface　of　the　oxidized　CeSn3　and　ErSn3　phase.　The　growth　behavior　of　tin　whiskers　formed　on　the　surface　of　the　oxidized　CeSn3　and　ErSn3　phases　was　investigated.　The　results　indicate　that　not　only　traditional　cylinder-like　tin　whiskers　but　also　some　special　ones　are　observed　on　the　surface　of　the　oxidized　CeSn3　and　ErSn3　phases,　such　as　stripe-like　tin　whiskers,　distorted　tin　whiskers,　tin　whiskers　with　variable　cross　sections,　branch-type　tin　whiskers,　merging-type　tin　whiskers　and　jointing-type　tin　whiskers　and　so　on.

关键词：

Binary alloys Cerium alloys Copper alloys Crystal whiskers Erbium alloys Lead-free solders Morphology Oxidation Rare earths Silver alloys Ternary alloys Tin Tin alloys

作者机构：

[ 1 ] [Hao, Hu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Li, Guangdong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Shi, Yaowu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Lei, Yongping]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

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电子邮件地址：

haohu@emails.bjut.edu.cn

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