Research of new Sn-Ag based lead-free composite solders containing nano-structured reinforcements - Details

Author：

Liu, Bin (Liu, Bin.) | Tai, Feng (Tai, Feng.) | Guo, Fu (Guo, Fu.) (Scholars：郭福) | Xia, Zhi-Dong (Xia, Zhi-Dong.) | Shi, Yao-Wu (Shi, Yao-Wu.) Unfold

Indexed by：

EI Scopus PKU CSCD

Abstract：

Composite　solders　were　fabricated　by　mechanically　mixing　the　Sn-3.5Ag　solder　paste　with　nano-scale　of　1%　(mass　fraction),　2%　and　3%　polyhedral　oligomeric　silsesquioxanes　(POSS)　particles.　POSS　microstructure,　melting　characteristic,　wetting　property　and　shear　strength　were　investigated.　The　results　showed　that　the　POSS　particle　didn＇t　change　the　melting　temperature　of　composite　solders.　Addition　of　POSS　in　the　Sn-3.5Ag　solder　increased　the　spreading　area　and　decreased　the　contact　angle　of　lead-free　composite　solder.　Shear　strength　of　POSS　particle　reinforced　composite　solder　joints　were　improved　remarkably.

Keyword：

Contact angle Reinforcement Particle reinforced composites Mechanical properties Wetting Melting Lead-free solders Binary alloys Nanotechnology

Author Community：

[ 1 ] [Liu, Bin]Center for Electronic Packaging Research and Testing, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Tai, Feng]Center for Electronic Packaging Research and Testing, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Guo, Fu]Center for Electronic Packaging Research and Testing, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Xia, Zhi-Dong]Center for Electronic Packaging Research and Testing, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Shi, Yao-Wu]Center for Electronic Packaging Research and Testing, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China