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TiNi shape memory alloy (SMA) and Stainless steel (SUS304) were joined by transient liquid phase (TLP) diffusion bonding using a Ag-Cu eutectic interlayer. The effect of bonding parameters-bonding temperature, holding time and bonding pressure on interface microstructures and mechanical property of bonded joint were investigated respectively. The results showed that the maximum shear strength was obtained for the specimens joined at 860C for 60 minutes under a specific pressure of 0.05 MPa. Through scanning electron microscopy (SEM) and X-ray diffractometry (XRD) test, the element distribution and phase composition of the joint welded under the optimum process parameters were investigated. And the joints were found to obtain α-Ag (Cu) solid solution and intermetallics TiNi2, TiFe and Ti3Ni4 etc. Based on interface microstructural characterization and element diffusion analysis, the kinetics of isothermal solidification was studied. It indicates that the process of TLP diffusion bonding of TiNi SMA and stainless steel shows a typical characteristic of asymmetry.
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