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Author:

Yu, He (Yu, He.) | Zhang, Qiang (Zhang, Qiang.) | Qiao, Da-Yong (Qiao, Da-Yong.) | Yu, Jian (Yu, Jian.)

Indexed by:

EI Scopus PKU CSCD

Abstract:

The fabrication and design of micro-electrodes (the key component of Electrohydrodynamic (EHD) micropump) using MEMS technology are studied in this paper. The main part of the EHD micropump is a planar electrode array composed of electrode pairs made of the emitter and the collector. The electrohydrodynamic (EHD) pump uses the interaction between an electric field and electric charges, dipoles or particles embedded in a dielectric fluid to drive the fluid. The major key-controlling variables including the selection of electrode materials, diversification of electrode geometrical design, comparison of different fabrication processes, electroplating and kit-off process are analyzed systematically. The experimental results show that noble metals have good performance of resistance for corrosion electrochemical processes, and the electrode with sharp geometry can improve the performance of micropump. It also shows that kit-off process is better than electroplating process in electrode quality.

Keyword:

Electroplating MEMS Electrochemical electrodes Electrochemical corrosion Electrohydrodynamics

Author Community:

  • [ 1 ] [Yu, He]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education Beijing University of Technology, Beijing 100022, China
  • [ 2 ] [Zhang, Qiang]Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
  • [ 3 ] [Qiao, Da-Yong]Micro and Nano Electromechanical System Laboratory, Northwestern Polytechnical University, Xi'an 710072, China
  • [ 4 ] [Yu, Jian]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education Beijing University of Technology, Beijing 100022, China

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Source :

Optics and Precision Engineering

ISSN: 1004-924X

Year: 2009

Issue: 7

Volume: 17

Page: 1635-1639

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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