A　novel　approach　to　heal　fatigue　damage　for　copper　film　by　unconstraint　vibration　was　proposed　in　this　paper.　The　microscope　observation　for　copper　film　under　various　conditions　was　conducted　on　exactly　the　same　area　by　electron　backscatter　diffraction　(EBSD)　method.　The　results　found　that　the　fraction　of　the　low　angle　grain　boundaries　(LAGBs),　the　dislocation　density,　the　stored　strain　energy,　and　the　grain　orientation　can　be　restored　to　the　original　state　after　the　unconstraint　vibration　treatment.　The　plastic　strain　energy　generated　in　the　damage　process　for　the　copper　film　before　and　after　the　treatment　was　analyzed.　It　was　found　that　the　increased　plastic　strain　energy　of　the　specimen　after　treatment　is　approximately　equal　to　the　consumed　plastic　strain　energy　of　the　specimen　before　treatment.　The　fatigue-healing　experimental　results　showed　that　the　fatigue　crack　initiation　life　is　about　2.6　times　that　of　no　treatment.