Microstructure and performance of SnAgCuEr lead-free solders with rare earth - 文章详情页

作者：

Tian, Jun (Tian, Jun.) | Hao, Hu (Hao, Hu.) | Shi, Yao-Wu (Shi, Yao-Wu.) | Lei, Yong-Ping (Lei, Yong-Ping.) (学者：雷永平) | Xia, Zhi-Dong (Xia, Zhi-Dong.)

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摘要：

The　effect　of　minimal　amount　of　rare　earth　Er　on　the　microstructure　and　performance　of　Sn3.8Ag0.7Cu　solder　alloy　has　been　systematically　investigated.　Through　measuring　the　melting　temperature,　wettability　and　joint　shear　strength,　and　observing　the　microstructure,　it　is　indicated　that　the　SnAgCuEr　alloy　containing　rare　earth　is　a　lead-free　solder　with　an　excellent　performance.　At　the　same　time　the　best　content　of　Er　is　determined.

关键词：

Silver alloys Copper alloys Metallographic microstructure Soldering alloys Melting point Tin alloys Wetting Erbium alloys Shear strength

作者机构：

[ 1 ] [Tian, Jun]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 2 ] [Hao, Hu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 3 ] [Shi, Yao-Wu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 4 ] [Lei, Yong-Ping]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Xia, Zhi-Dong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China

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电子邮件地址：

tianjun@emails.bjut.edu.cn

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