Solidification crack of SnAgCu lead-free solder joint - 文章详情页

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摘要：

In　order　to　investigate　solidification　crack　of　SnAgCu　solder　joint　on　the　print　circuit　board　(PCB),　solidification　cracks　during　solidification　are　regenerated,　the　process　of　the　solidification　crack　fonnation　on　the　designed　specimen　is　simulated,　and　the　effect　of　the　small　element　additions　on　the　solidification　crack　formation　of　SnAgCu　solder　joint　is　researched.　Experimental　results　indicate　that　some　solidification　micro-cracks　exist　significantly　on　the　mini　SnAgCu　solder　joint.　The　solidification　crack　susceptibility　of　Sn-Ag-Cu　solder　alloy　is　evaluated　by　the　total　crack　length　of　the　solder　joint,　adding　trace　amounts　of　Ni　and　Ce　element　can　depress　the　solidification　crack　formation　of　the　solder　joints,　but　adding　P　element　can　aggravate　the　solidification　crack　formation　of　SAC305　solder　joint　and　make　the　crack　length　evidently　increase.

关键词：

Copper alloys Lead-free solders Silver alloys Soldered joints Solidification Ternary alloys Tin alloys Trace elements

作者机构：

[ 1 ] [Dong, Wenxing]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Shi, Yaowu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Xia, Zhidong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Lei, Yongping]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Guo, Fu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Li, Xiaoyan]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

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dongwenxing@emails.bjut.edu.cn

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