Fracture　of　the　soldered　joints　is　the　most　common　failure　mechanism　in　microsystem　packages　due　to　mechanical　loads.　In　order　to　satisfy　the　demand　for　understanding　the　process　of　soldered　joints　fracture,　there　is　a　need　for　a　validated　model,　which　is　simple,　reliable,　and　able　to　clarify　of　physics-of-failure　of　soldered　joints　for　design　improvement.　The　lattice　model　had　been　established　to　simulate　the　process　of　soldered　joints　fracturing.　The　cracking　pattern　from　the　simulation　was　compared　with　that　observed　in　experiments.　The　results　show　that　the　proposed　lattice　model　can　easily　be　used　to　predict　the　cracking　of　soldered　joints　under　tensile　loading.　The　predicted　crack　pattern　agrees　well　with　that　observed　in　experiments.