Effect of PCB bending stiffness on peeling stress of solder joints in electronics packaging - 文章详情页

作者：

Qin, Fei (Qin, Fei.) (学者：秦飞) | An, Tong (An, Tong.)

收录：

EI Scopus PKU CSCD

摘要：

A　standard　board-level　drop/impact　test　has　been　modeled　as　a　beam　system,　and　the　proposed　model　was　used　to　analyze　the　peeling　stress　in　solder　joints　under　static　and　dynamic　loadings.　The　analyses　have　shown　that　the　maximum　peeling　stress　is　located　at　the　most　outer　side　of　the　PCB.　The　maximum　peeling　stress　obtained　from　static　analysis　is　higher　than　that　from　the　dynamic　analysis.　The　stiffness　ratio　between　the　package　and　the　PCB　has　significant　influence　on　the　peeling　stress　in　solder　joints,　and　the　peeling　stress　tends　to　reach　its　maximum　as　the　PCB　and　the　package　have　identical　bending　stiffness.

关键词：

Drops Dynamic loads Electronics packaging Finite element method Printed circuit boards Soldered joints Stiffness

作者机构：

[ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100022, China
[ 2 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100022, China

通讯作者信息：

电子邮件地址：

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至