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[期刊论文]

Finite element simulation of unconstraint vibration treatment for fatigued copper film

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Author:

Zhang, Hai-Meng (Zhang, Hai-Meng.) | Shang, De-Guang (Shang, De-Guang.) (Scholars:尚德广) | Lv, Shuai (Lv, Shuai.) | Unfold

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EI Scopus SCIE

Abstract:

In this paper, in order to investigate the residual strain relief in the fatigued copper film with a thickness of 33 urn, an unconstraint vibration treatment process was simulated by finite element (FE) method. The experimental processes, including fatigue and unconstraint vibration processes, were simulated. The fatigue process for the original specimen and the vibration process for the damaged specimen were analyzed by the static and transient dynamic analysis, respectively. The simulation results showed that the unconstraint vibration treatment can lead to the residual strain of the fatigued copper film to be reduced and redistributed. The effect of the vibration parameters on the treatment effectiveness was analyzed by the different fatigue experiments and unconstraint vibration treatments, and the results showed that the FE simulation results are in agreement with the experimental observations.

Keyword:

Residual strain relief Unconstraint vibration treatment FE simulation Fatigue damage

Author Community:

  • [ 1 ] [Zhang, Hai-Meng]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 2 ] [Shang, De-Guang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 3 ] [Lv, Shuai]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 4 ] [Liu, Xiao-Dong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 5 ] [Zhang, Yu]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China

Reprint Author's Address:

  • 尚德广

    [Shang, De-Guang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China

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Source :

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY

ISSN: 1738-494X

Year: 2019

Issue: 9

Volume: 33

Page: 4345-4352

1 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:3

Cited Count:

WoS CC Cited Count: 0

30 Days PV: 0

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