Texture　and　grain　boundary　character　distribution　of　Cu　interconnects　with　different　line　width　for　as-deposited　and　annealed　conditions　were　measured　by　EBSD.　All　specimens　appear　mixed　texture　and　(111)　texture　is　the　dominate　component.　As-deposited　interconnects　undergo　the　phenomenon　of　self-annealing　at　RT,　in　which　some　abnormally　large　grains　are　found.　Lower　aspect　ratio　of　lines　and　anneal　treatment　procured　larger　grains　and　stronger　(111)　texture.　Meanwhile,　the　intensity　proportion　of　other　textures　with　lower　strain　energy　to　(111)　texture　is　decreased.　As-deposited　specimens　reveal　(111)　and　(111)　components.　(111)　component　appeared　and　(111)　and　(111)　components　were　developed　during　the　annealing　process.　High　angle　boundaries　are　dominant　in　all　specimens,　boundaries　with　a　misorientation　of　55-60　and　∑3　ones　in　higher　proportion,　followed　by　lower　boundaries　with　a　mi-sorientation　of　35-40　and　∑9　boundaries.　As　the　aspect　ratio　of　lines　and　anneal　treatment　increase,　there　is　a　gradual　increment　in　∑3　boundaries　and　a　decrease　in　∑9　boundaries.