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作者:

Wang, Ying-Ling (Wang, Ying-Ling.) | Li, Hong (Li, Hong.) | Li, Zhuo-Xin (Li, Zhuo-Xin.) | Feng, Ji-Cai (Feng, Ji-Cai.)

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摘要:

Transient liquid phase diffusion bonding (TLP-DB) of TiNi shape memory alloy (SMA) to stainless steel was performed with AgCu foil as interlayer. The effect of bonding temperature, holding time and bonding pressure was also investigated. The results showed that the maximum shear strength of the joint was obtained for the specimens joined at 860C for 60 minutes with a specific pressure of 0.05 MPa. Through scanning electron microscopy (SEM) and X-ray diffractometry (XRD) test, the element distribution and phase composition of the joint welded under the optimum process parameters were investigated. It indicated that the joint property was significantly influenced by the formation of intermetallics TiNi2, TiFe and Ti3Ni4 etc.

关键词:

Binary alloys Copper alloys Copper metallography Diffusion Diffusion bonding Iron metallography Liquids Nickel metallography Nickel steel Scanning electron microscopy Shape-memory alloy Shear strength Silver alloys Silver metallography Stainless steel Titanium alloys Titanium metallography Welds X ray diffraction analysis

作者机构:

  • [ 1 ] [Wang, Ying-Ling]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Li, Hong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Li, Zhuo-Xin]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [Li, Zhuo-Xin]State Key Lab. of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China
  • [ 5 ] [Feng, Ji-Cai]State Key Lab. of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

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来源 :

Journal of Materials Engineering

ISSN: 1001-4381

年份: 2008

期: 9

页码: 48-51,55

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