In　order　to　meet　the　demand　of　micro　film　apparatus　in　micro　electronic　industry,　a　series　of　experiments　were　carried　out　on　the　ultraviolet　laser　cutting　thin　metal　film,　and　the　effects　of　laser　cutting　parameters　on　the　kerf　width　and　quality　were　studied.　Aiming　at　the　high　flexible　coefficient　and　easy　deformed　etc.　characteristics　of　thin　metal　film,　a　special　clamp　and　cutting　equipment　was　introduced.　The　results　showed　that　during　the　process　of　the　high　power　ultraviolet　laser　precise　cutting,　according　to　the　kind　and　thickness　of　thin　metal　film,　suitable　ultraviolet　laser　power　and　cutting　speed　are　selected　to　decrease　the　kerf　width　and　good　kerf　quality　is　obtained;　besides,　suitable　fixing　method　for　the　thin　metal　film　is　selected　to　ensure　the　thin　film　no　distortion　and　improve　the　cutting　precision　and　the　success　probability　of　the　micro　film　apparatus　machining　effectively.